Plymouth, MA – February 17th, 2025 – Tech Etch, a global leader in EMI/RFI shielding solutions, proudly announces the launch of its 2591 Conductive Fabric Over Foam Series. This groundbreaking addition to the D Connector Gasket line brings unmatched performance, environmental compliance, and versatility to shielding applications across industries.
The 2591 Conductive Foam Series features nickel-plated copper nylon ripstop fabric bonded over an open-cell polyurethane core. This combination ensures superior electromagnetic interference (EMI) shielding, durability, and ease of use, meeting the demanding requirements of modern electronics. Available in 5 connector sizes, the new series provides optimal solutions for applications ranging from handheld devices to wireless communication equipment.
Key Features Include:Â
- High Shielding Effectiveness:Â Achieves attenuation levels exceeding 85dB across a frequency range of 10 MHz to 3 GHz.
- Durability and Flexibility:Â Offers low compression force, excellent conductivity, and resistance to permanent deformation for reliable, long-term performance.
- Environmentally Friendly:Â Compliant with RoHS, REACH, and UL94 V-0 standards, ensuring a halogen-free, sustainable design.
- Customizable Options:Â Available in standard sizes, with pressure-sensitive nonconductive tape or conductive adhesive mounting for easy installation.
“Our new 2591 Conductive Foam Series reflects Tech Etch’s commitment to delivering cutting-edge EMI shielding solutions that address today’s complex technological challenges,” said Mark Strangie, Vice President of Sales and Marketing at Tech Etch. “With its superior performance and environmental compliance, this product not only meets but exceeds industry standards, ensuring our customers have the best tools for their innovations.”
Applications and BenefitsÂ
The 2591 series is designed for seamless integration into D-subminiature connectors and other critical interfaces. It’s easy-to-compress material and versatile mounting options make it ideal for various sectors, including computer, telecommunications, and consumer electronics.
Tech Etch continues to innovate by listening to customer needs and anticipating market demands. The 2591 Conductive Fabric Over Foam Series reaffirms the company’s position as a trusted partner in EMI/RFI shielding and advanced materials.
For more information on the 2591 Conductive Foam Series or to request a quote, visit https://techetch.com/products/d-connector-gaskets/ or contact Tech Etch at shielding@techetch.com.
About Tech EtchÂ
Tech Etch has over six decades of experience and expertise specializing in manufacturing precision-engineered thin metal components, flexible printed circuits, and EMI/RFI shielding, across three locations in the United States (Plymouth, MA, Fall River, MA, and Litchfield, MN). Their commitment to excellence begins with employee-owners who provide world-class services and innovative comprehensive solutions that enhance lives globally. Tech Etch partners with leading global customers in the aerospace, alternative energy, military, medical, telecommunication, and electronics industries that have precise designs and demanding regulatory requirements. Their solutions ensure unmatched precision, quality, and attention to detail in every project, every time.